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(India.CityRegions.Com, September 29, 2018 ) This report covers the present scenario (with the base year being 2017) and the growth prospects of Global Wire Wedge Bonder Equipment Consumption Market for 2018-2023.
Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects (also known as die-to-die bonding and chain bonding), reverse bonding, and ribbon bonding. Market research analysts predict that the global Wire Wedge Bonder Equipment market will grow steadily during the next five years and post a CAGR of nearly 1.04% by 2022. This market research analysis identifies the increasing design complexity of semiconductor devices as one of the primary growth factors for the global Wire Wedge Bonder Equipment market.
The Wire Wedge Bonder Equipment market is a part of the overall semiconductor packaging and assembly equipment market. The shift in semiconductor packaging towards 3D IC technology will intensify the competition between the IDMs and OSATs. The packaging market has a huge potential and provides several growth opportunities to IDMs and OSATs. IDMs are working on expanding into the assembly business, while the OSATs are trying to make use of this opportunity to raise the profit margins. In 2016, IDMs held the maximum market shares during 2016 and this segment is projected to continue its market dominance during the forecasted period as well. The need to increase production capacity and the need to adhere to the constant technological innovation in packaging techniques will be the major factors fueling market growth.
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Wire Wedge Bonder Equipment industry is highly concentrated, manufacturers are mostly in the Europe, US and Asia. Among them, Singapore output volume accounted for more than 53.24% of the total output of global Wire Wedge Bonder Equipment in 2016. Kulicke & Soffa is the world leading manufacturer in global Wire Wedge Bonder Equipment market with the market share of 54.19%, in terms of revenue, followed by ASM Pacific Technology (ASMPT), Hesse, Cho-Onpa and F&K Delvotec Bondtechnik. It shows that the Wire Wedge Bonder Equipment market performance is positive, despite the weak economic environment.
Over the next five years, experts projects that Wire Wedge Bonder Equipment will register a 1.1% CAGR in terms of revenue, reach US$ 100 million by 2023, from US$ 92 million in 2017.
This report presents a comprehensive overview, market shares, and growth opportunities of Wire Wedge Bonder Equipment market by product type, application, key manufacturers and key regions. To calculate the market size, experts considers value and volume generated from the sales of the following segments:
Segmentation by product type:
Fully Automatic
Semi-automatic
Manual
Segmentation by application:
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
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This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report:
Kulicke & Soffa
ASM Pacific Technology (ASMPT)
Hesse
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
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Table of Content:
2018-2023 Global Wire Wedge Bonder Equipment Consumption Market Report
1 Scope of the Report
1.1 Market Introduction
1.2 Research Objectives
1.3 Years Considered
1.4 Market Research Methodology
1.5 Economic Indicators
1.6 Currency Considered
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Wire Wedge Bonder Equipment Consumption 2013-2023
2.1.2 Wire Wedge Bonder Equipment Consumption CAGR by Region
2.2 Wire Wedge Bonder Equipment Segment by Type
2.2.1 Fully Automatic
2.2.2 Semi-automatic
2.2.3 Manual
3 Global Wire Wedge Bonder Equipment by Players
3.1 Global Wire Wedge Bonder Equipment Sales Market Share by Players
3.1.1 Global Wire Wedge Bonder Equipment Sales by Players (2016-2018)
3.1.2 Global Wire Wedge Bonder Equipment Sales Market Share by Players (2016-2018)
3.2 Global Wire Wedge Bonder Equipment Revenue Market Share by Players
3.2.1 Global Wire Wedge Bonder Equipment Revenue by Players (2016-2018)
3.2.2 Global Wire Wedge Bonder Equipment Revenue Market Share by Players (2016-2018)
3.3 Global Wire Wedge Bonder Equipment Sale Price by Players
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Qurate Business Intelligence
Nehal Chinoy
+919881074592
nehal@qurateresearch.com
Source: EmailWire.Com
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